HKU-EEE Signs MoU with the Singapore International School (Hong Kong) Strengthening Research and Development Between the University and High School Community

June 12, 2025

On June 5, 2025, the Department of Electrical and Electronic Engineering at The University of Hong Kong (HKU-EEE) signed a Memorandum of Understanding (MoU) with the Singapore International School (Hong Kong) (SISHK), marking the beginning of an internship scheme that will bring Diploma Programme (DP) students from SISHK to the Department to participate in research projects and experiential learning during the summer holidays, as part of our ongoing efforts towards providing exposure to the Research and Development (R&D) environments for the high school community.

The MoU was signed by Professor Kaibin HUANG (left), Head of the HKU-EEE Department, and Ms. Pamela YOONG (right), Principal of SISHK.