We extend our heartfelt congratulations to Prof. Shiming ZHANG from the Department of Electrical and Electronic Engineering (EEE) at The University of Hong Kong (HKU), whose groundbreaking research on 3D semiconductors just landed on the cover of Science!
This work reports the world’s first 3D semiconductors in the form of hydrogels, featuring millimeter-thick bulk modulation. They have the potential to advance energy-efficient computing, neuroscience research, and medicine.
The HKU-WISE Lab has developed the first-ever 3D semiconductors in the form of hydrogels, merging organic electronics, soft matter, and electrochemistry. These groundbreaking semiconductors offer tissue-like softness, biocompatibility, and millimeter-scale modulation thickness. They enable 3D spatially interpenetrated transistors that mimic neuronal connections, bridging the gap between rigid 2D electronics and the dynamic 3D nature of biological systems. Potential applications include implantable soft biochips for brain disease management and memory enhancement.
Read more on the paper: https://www.science.org/doi/10.1126/science.adx4514