Biography
Darong HUANG is an Assistant Professor in the Department of Electrical and Computer Engineering at The University of Hong Kong (HKU). Prior to joining HKU, he was a Postdoctoral Scholar at École Polytechnique Fédérale de Lausanne (EPFL) in Switzerland, where he also earned his Ph.D. degree. He received his B.E. and M.Sc. degrees from the University of Electronic Science and Technology of China in 2016 and 2019, respectively. His research interests include thermal modelling and management for 2.5D/3D packaging, multi-objective optimisation for cloud applications, and integrated communication and computation architectures.
Related Links
Selected Publications
- Zhu, K., Huang, D., Costero, L., & Atienza, D. (2026). 3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5 D/3D heterogeneous chiplet systems. In 2026 Design, Automation & Test in Europe Conference (DATE).
- Liu, Q., Huang, D., Zapater, M., & Atienza, D. (2026). GreenLLM: SLO-Aware Dynamic Frequency Scaling for Energy-Efficient LLM Serving. In 2026 ACM/IEEE Design Automation Conference (DAC).
- Huang, D., Costero, L., & Atienza, D. (2024). An evaluation framework for dynamic thermal management strategies in 3D multiProcessor system-on-chip co-design. IEEE Transactions on Parallel and Distributed Systems, 35(11), 2161-2176.
- Huang, D., Costero, L., Pahlevan, A., Zapater, M., & Atienza, D. (2024). Cloudprophet: a machine learning-based performance prediction for public clouds. IEEE Transactions on Sustainable Computing, 9(4), 661-676.
- Huang, D., Pahlevan, A., Costero, L., Zapater, M., & Atienza, D. (2022). Reinforcement learning-based joint reliability and performance optimization for hybrid-cache computing servers. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 41(12), 5596-5609.