Zoom Link
https://hku.zoom.us/j/92285676627?pwd=oaba8ue6daTbmrDBhxaIhYsykCedbR.1
Abstract
During the period of the Internet of Things (IoT) and big data, data capacity is growing exponentially, the delay and loss caused by data transmission make the traditional von Neumann computing architecture urgently need to be overturned and restructured. This has led to a growing demand for emerging memory devices, posing significant challenges to conventional silicon-based memory technologies. In recent years, two-dimensional (2D) materials leveraging their unique physical properties, ultra-thin thickness and no dangling bonds have been wide-ranging used in the fabrication of various electronic and optoelectronic memory devices. In this seminar, we first briefly introduce several mainstream types of 2D memory devices developed in recent years and their working mechanisms. We then propose a 2D infrared-sensing memory device (ISMD) based on the Se0.3Te0.7/CuInP2S6 (CIPS) heterostructure, where Se0.3Te0.7 serves as the channel and CIPS functions as the ferroelectric auxiliary layer. The coupling between interfacial defect trapping and ferroelectric polarization endows the device with non-volatile multi-bit memory capability programmable by electrical pulses. Meanwhile, the device exhibits a transient infrared response at 1550 nm, with its responsivity negatively correlated to the channel conductance. By integrating sensing, memory, and computing in a single device, this work broadens the research scope of 2D memory devices.
Speaker
Mr. Xuyang ZHENG
Department of Electrical and Computer Engineering
The University of Hong Kong
Biography of the Speaker
Xuyang Zheng is an MPhil student in the Department of Electrical and Computer Engineering at The University of Hong Kong, supervised by Prof. Can Li. He received his B.S. degree in Functional Materials from South China University of Technology (SCUT) in 2024. His research interests include 2D memory devices for neuromorphic computing.
Organiser
Prof. Can LI
Department of Electrical and Computer Engineering, The University of Hong Kong
All are welcome.