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PRODID:-//Department of Electrical and Computer Engineering (HKUECE) 電機與計算機工程系 - ECPv6.15.20//NONSGML v1.0//EN
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X-WR-CALNAME:Department of Electrical and Computer Engineering (HKUECE) 電機與計算機工程系
X-ORIGINAL-URL:https://ece.hku.hk
X-WR-CALDESC:Events for Department of Electrical and Computer Engineering (HKUECE) 電機與計算機工程系
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TZID:Asia/Hong_Kong
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TZOFFSETFROM:+0800
TZOFFSETTO:+0800
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DTSTART:20230101T000000
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BEGIN:VEVENT
DTSTART;TZID=Asia/Hong_Kong:20241205T110000
DTEND;TZID=Asia/Hong_Kong:20241205T120000
DTSTAMP:20260510T222459
CREATED:20241126T020836Z
LAST-MODIFIED:20250211T042315Z
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SUMMARY:Empowering High-Performance Computing Through Heterogeneous Integration of Power Electronics
DESCRIPTION:Abstract\nMost power electronic equipment\, including power supplies for Artificial Intelligence (AI) and high-performance computing systems\, has traditionally been designed using discrete active and passive components. However\, the power electronics industry has reached a stage where improving one performance attribute often comes at the expense of others. As AI and high-performance computing systems demand increasingly higher power levels\, existing power delivery architectures are proving inadequate. Delivering the required power to server racks\, circuit boards\, accelerator cards\, and AI processors has become an escalating challenge. The emergence of wide-bandgap (WBG) power semiconductor devices\, such as silicon carbide (SiC) and gallium nitride (GaN)\, presents a breakthrough opportunity. Compared to silicon (Si) devices\, WBG technologies offer significantly lower losses\, providing a promising solution to the energy challenges of high-performance computing. However\, current design practices often adopt a ‘plug-and-play’ approach\, merely replacing Si with WBG components without altering the underlying design principles. This results in only incremental improvements in efficiency and power density\, leaving the transformative potential of WBG devices untapped. This presentation will explore a paradigm shift in powering AI and high-performance computing systems through the use of high-frequency heterogeneous integration in WBG power electronics design. This innovative approach delivers simultaneous advancements in all critical performance metrics\, including efficiency\, power density\, and electromagnetic compatibility (EMC). Furthermore\, this approach can streamline traditionally labor-intensive manufacturing processes\, paving the way for significant advancements in overall production efficiency. \nSpeaker\nProf. Qiang Li\nFull Professor\,\nCenter for Power Electronics Systems (CPES)\,\nVirginia Tech \nBiography of the Speaker\nQiang Li received the B.S. and M.S. degrees from Zhejiang University\, China\, in 2003 and 2006\, respectively\, and the Ph.D. degree from Virginia Tech\, Blacksburg\, VA\, in 2011. He is currently a Full Professor in the Center for Power Electronics Systems (CPES) at Virginia Tech. His research interests include high-frequency power conversion and control\, high-density electronics packaging and magnetic integration\, as well as power solutions for high-performance computing\, data centers\, electric vehicles\, and energy storage systems. With over 300 peer-reviewed technical publications\, including 100 journal articles\, he has received eight prize paper awards and holds 26 U.S. patents. He currently serves as the Chair of Academic Affairs for the IEEE Power Electronics Society and is an associate editor for both the IEEE Transactions on Power Electronics and the IEEE Journal of Emerging and Selected Topics in Power Electronics. Dr. Li is also a recipient of the U.S. National Science Foundation (NSF) Career Award. \nOrganiser\nProf. Han Wang \nAll are welcome!
URL:https://ece.hku.hk/events/20241205-2/
LOCATION:Room CB-603\, 6/F\, Chow Yei Ching Building\, The University of Hong Kong
CATEGORIES:Highlights,Seminar
ATTACH;FMTTYPE=image/jpeg:https://ece.hku.hk/wp-content/uploads/2024/11/1280-copy.jpg
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BEGIN:VEVENT
DTSTART;TZID=Asia/Hong_Kong:20241205T150000
DTEND;TZID=Asia/Hong_Kong:20241205T160000
DTSTAMP:20260510T222459
CREATED:20241120T071853Z
LAST-MODIFIED:20250211T042315Z
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SUMMARY:Multimode Fiber Communication and Multicore Fiber Endoscopy Exploiting Physics-informed Deep Neural Networks
DESCRIPTION:Abstract\nAdvances in fiber-optic systems are crucial for the internet. To cope with this continued exponential growth as Keck´s law\, multimode fibers (MMF) with spatial division multiplexing (SDM) are proposed. However\, there are challenging mode scattering effects in MMF. Physics-informed deep learning enables to correct the scattering\, resulting in advancing security and data rate. We highlight also 3D imaging with lensless multicore fiber endoscopes exploiting learnable multiple Wiener net. Multimode fiber communication and multicore fiber endoscopy are promising for advancements of the internet of things and of biomedical diagnostics and therapy. \nSpeaker\nProf. Jürgen Czarske\nDirector and Full Chair Professor，\nTU Dresden\, Germany \nBiography of the Speaker\nJuergen W Czarske (Fellow EOS\, OPTICA\, SPIE\, IET\, IOP) is director and full chair professor of the TU Dresden\, Germany. His awards include the 2019 OPTICA Joseph-Fraunhofer-Award/Robert-M.-Burley-Prize in Optical Engineering and the 2024 SPIE Dennis Gabor Award in Diffractive Optics. Juergen fosters talented students early. The students and members of his lab have won over 100 prizes\, including Bertha-Benz award of Daimler Benz Foundation (10\,000 Euro). Juergen is Vice President of International Commission for Optics\, ICO\, and was the general chair of the world congress ICO-25\, which was co-sponsored by OPTICA\, SPIE\, IEEE\, Zeiss\, DGaO-The German Branch of EOS\, IUPAP. 3 Nobel laureates have delivered plenary lectures and the participants came from 5A (America\, Asia\, Australia\, Africa and Amazing Europe). \nOrganiser\nProf. Kevin K.M. Tsia\nDepartment of Electrical and Electronic Engineering\,\nThe University of Hong Kong \nSupported by\nInnovation Wing Two \nAll are welcome!
URL:https://ece.hku.hk/events/20241205-1/
LOCATION:Tam Wing Fan Innovation Wing Two\, G/F\, Run Run Shaw Building\, The University of Hong Kong
CATEGORIES:Highlights,Seminar
ATTACH;FMTTYPE=image/jpeg:https://ece.hku.hk/wp-content/uploads/2025/01/1280-2.jpg
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