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PRODID:-//Department of Electrical and Computer Engineering (HKUECE) 電機與計算機工程系 - ECPv6.15.20//NONSGML v1.0//EN
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X-WR-CALNAME:Department of Electrical and Computer Engineering (HKUECE) 電機與計算機工程系
X-ORIGINAL-URL:https://ece.hku.hk
X-WR-CALDESC:Events for Department of Electrical and Computer Engineering (HKUECE) 電機與計算機工程系
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TZID:Asia/Hong_Kong
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TZOFFSETFROM:+0800
TZOFFSETTO:+0800
TZNAME:HKT
DTSTART:20240101T000000
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BEGIN:VEVENT
DTSTART;TZID=Asia/Hong_Kong:20250307T093000
DTEND;TZID=Asia/Hong_Kong:20250307T223000
DTSTAMP:20260509T210612
CREATED:20250304T072753Z
LAST-MODIFIED:20250306T015705Z
UID:110555-1741339800-1741386600@ece.hku.hk
SUMMARY:Revolutionizing Power Electronics with Heterogeneous Integration
DESCRIPTION:Abstract\nTraditional power electronic equipment has long relied on discrete active and passive components\, with performance enhancements often requiring trade-offs. Despite technological advancements\, manufacturing processes remain labor-intensive and largely unchanged for decades. \nThe advent of wide-bandgap (WBG) power semiconductor devices\, such as silicon carbide (SiC) and gallium nitride (GaN)\, has significantly reduced conduction and switching losses compared to silicon-based counterparts. However\, current design methodologies primarily follow a ‘plug-and-play’ approach\, yielding only incremental improvements in efficiency and power density without fully leveraging the transformative potential of these technologies. \nThis presentation explores the integration of matrix magnetics with WBG power devices to drive a fundamental shift in power electronics design and manufacturing through heterogeneous integration. This holistic approach enables simultaneous enhancements in efficiency\, power density\, cost\, and electromagnetic interference (EMI) performance. Additionally\, it streamlines traditionally labor-intensive manufacturing processes—particularly those involving magnetics and system assembly—through automation. \nThe discussion will feature multiple research examples demonstrating heterogeneous integration of matrix magnetics in power converters across diverse applications and power ranges. These include high-frequency power converters for artificial intelligence (AI) and high-performance computing systems\, battery chargers for electric vehicles\, and solid-state transformers for DC power distribution. \n\nSpeaker\nProf. Qiang LI\nCenter for Power Electronics Systems (CPES)\,\nVirginia Tech \nBiography of the Speaker\nQiang Li received the B.S. and M.S. degrees from Zhejiang University\, China\, in 2003 and 2006\, respectively\, and the Ph.D. degree from Virginia Tech\, Blacksburg\, VA\, in 2011. He is currently a full professor in the Center for Power Electronics Systems (CPES) at Virginia Tech. His research interests include high-frequency power conversion and control\, high-density electronics packaging and magnetic integration\, as well as power solutions for high-performance computing\, data centers\, electric vehicles\, and energy storage systems. With over 300 peer-reviewed technical publications\, including 100 journal articles\, he has received eight prize paper awards and holds 26 U.S. patents. He currently serves as the Chair of Academic Affairs for the IEEE Power Electronics Society and is an associate editor for both the IEEE Transactions on Power Electronics and the IEEE Journal of Emerging and Selected Topics in Power Electronics. He is also a recipient of the U.S. National Science Foundation (NSF) Career Award. \nOrganiser\nDepartment of Electrical and Electronic Engineering\,\nThe University of Hong Kong \nAll are welcome!
URL:https://ece.hku.hk/events/20250307-2/
LOCATION:Room CB-603\, 6/F\, Chow Yei Ching Building\, The University of Hong Kong
CATEGORIES:Highlights,Seminar
ATTACH;FMTTYPE=image/jpeg:https://ece.hku.hk/wp-content/uploads/2025/03/1280-2.jpg
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