BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Department of Electrical and Computer Engineering (HKUECE) 電機與計算機工程系 - ECPv6.15.20//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://ece.hku.hk
X-WR-CALDESC:Events for Department of Electrical and Computer Engineering (HKUECE) 電機與計算機工程系
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:Asia/Hong_Kong
BEGIN:STANDARD
TZOFFSETFROM:+0800
TZOFFSETTO:+0800
TZNAME:HKT
DTSTART:20240101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=Asia/Hong_Kong:20251110T163000
DTEND;TZID=Asia/Hong_Kong:20251110T173000
DTSTAMP:20260510T192807
CREATED:20251106T094008Z
LAST-MODIFIED:20251106T100516Z
UID:113831-1762792200-1762795800@ece.hku.hk
SUMMARY:3D Intelligent Metasurfaces and Their Applications
DESCRIPTION:Abstract\nIn this talk\, we will introduce two innovative types of 3D intelligent metasurfaces: Stacked Intelligent Metasurfaces (SIM) and Flexible Intelligent Metasurfaces (FIM). We will explore their exciting applications in wireless communication and sensing systems. Specifically\, SIM is a groundbreaking computing architecture that enables joint signal processing and communication in the electromagnetic (EM) domain. A SIM is fabricated by stacking an array of programmable metasurface layers\, where each layer consists of many low-cost passive meta-atoms that can individually manipulate EM waves. By appropriately configuring the passive meta-atoms\, a SIM can automatically accomplish advanced computation tasks as the EM wave propagates through it while reducing both energy consumption and processing delay. By contrast\, an FIM takes a different approach to leverage the 3D physical space. An FIM is composed of an array of low-cost radiating elements\, each of which can independently radiate electromagnetic signals while flexibly adjusting its position along the direction perpendicular to the surface. Hence\, unlike conventional rigid 2D antenna arrays\, the FIM surface shape may be dynamically reconfigured to improve the channel quality by beneficial 3D morphing. \nSpeaker\nProf. Chau YUEN\nAssociate Professor\,\nNanyang Technological University \nSpeaker’s Biography\nChau YUEN received the B.Eng. and Ph.D. degrees from Nanyang Technological University\, Singapore\, in 2000 and 2004\, respectively. He was a Post-Doctoral Fellow with Lucent Technologies Bell Labs\, Murray Hill\, in 2005. From 2006 to 2010\, he was with the Institute for Infocomm Research\, Singapore. Since 2023\, he has been with the School of Electrical and Electronic Engineering\, Nanyang Technological University. Dr. Yuen received IEEE Communications Society Leonard G. Abraham Prize (2024)\, IEEE Communications Society Best Tutorial Paper Award (2024)\, IEEE Communications Society Fred W. Ellersick Prize (2023)\, IEEE Marconi Prize Paper Award in Wireless Communications (2021)\, IEEE APB Outstanding Paper Award (2023)\, and EURASIP Best Paper Award for JOURNAL ON WIRELESS COMMUNICATIONS AND NETWORKING (2021).  He is an IEEE Fellow and also a Highly Cited Researcher by Clarivate Web of Science. \nOrganiser\nProf. Kaibin HUANG\nDepartment of Electrical and Electronic Engineering\,\nThe University of Hong Kong\n\nAll are welcome!
URL:https://ece.hku.hk/events/20251110-1/
LOCATION:Room CB-603\, 6/F\, Chow Yei Ching Building\, The University of Hong Kong
CATEGORIES:Highlights,Seminar
ATTACH;FMTTYPE=image/jpeg:https://ece.hku.hk/wp-content/uploads/2025/11/1280-1.jpg
END:VEVENT
END:VCALENDAR