BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Department of Electrical and Computer Engineering (HKUECE) 電機與計算機工程系 - ECPv6.16.0//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://ece.hku.hk
X-WR-CALDESC:Events for Department of Electrical and Computer Engineering (HKUECE) 電機與計算機工程系
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:Asia/Hong_Kong
BEGIN:STANDARD
TZOFFSETFROM:+0800
TZOFFSETTO:+0800
TZNAME:HKT
DTSTART:20220101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;VALUE=DATE:20231114
DTEND;VALUE=DATE:20231115
DTSTAMP:20260513T083040
CREATED:20231102T074244Z
LAST-MODIFIED:20250114T080350Z
UID:17803-1699920000-1700006399@ece.hku.hk
SUMMARY:On-chip Spectrum Detection and Sub-diffraction Optical Microscopy
DESCRIPTION:Spectral analysis is one of the most widely adopted techniques in various fields of scientific research\, industrial production\, and medical diagnostics. Yet\, traditional spectrum detection techniques often require the setup of spectroscopic components\, photodetector arrays\, and mechanical positioning parts and so on. The relatively large size of those instrumentations may limit their applicability for small-scale or in-situ spectral sensing. In this study\, by leveraging the continuous tunability of the optical bandgap in halide perovskites\, along with the innovation in device architecture/fabrication processes/detection principles\, the authors succeeded to develop single device-based color detectors and integrated flexible spectral sensors. This finding presents promising applications in artificial intelligence vision systems as well as the intelligent sensors in the Internet of Things. \nThough the advanced integrated circuit (IC) fabrication processes are able to fabricate nanoscale devices\, there still remain numerous puzzles in the other domains such as life science\, material science to be explored at nanoscale. In the aim of extending the applicability of advanced IC manufacturing techniques to the other domains\, the authors have developed an ultra-high-density image sensor. After overcoming a series of challenges in semiconductor materials optimization\, photodetector performance improvement\, circuit design\, and sub-wavelength optical physics\, the ultra-high-density image sensor can be utilized in on-chip sub-diffraction optical microscopy. It is expected that this breakthrough will have profound applications in multiple fields such as nanoscience and life science. \nZoom Link :\nhttps://us05web.zoom.us/j/87181504042?pwd=wfGHZAGyUNyUwWiTBHnzgrUtMv9Cra.1 \nMeeting ID: 871 8150 4042\nPasscode: 7zscGQ\n\nBiography of the speaker:\n\nDr. Xiaohan WU\, Associate Professor\, at the School of Microelectronics\, Fudan University\, doctoral advisor. He has been awarded in the Shanghai Young Talents Program and the Shanghai Young Technological Star Program\, and serves as a council member of the Fudan University Young Teachers’ Association. His research focuses on novel image sensors\, advanced memories\, and flexible electronics. Supported by projects from the National Nature Science Foundation and the Minister of Science and Technology of China\, his research works have been published over 60 papers in international academic journals and received more than 10 granted patents.
URL:https://ece.hku.hk/events/on-chip-spectrum-detection-and-sub-diffraction-optical-microscopy/
CATEGORIES:Seminar
ATTACH;FMTTYPE=image/jpeg:https://ece.hku.hk/wp-content/uploads/2024/02/Seminar-s-banner.jpg
END:VEVENT
END:VCALENDAR